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BRIEF-Arcam subsidiary files patent application

Published 2015-11-04, 09:04 a/m
© Reuters.  BRIEF-Arcam subsidiary files patent application
ARCM
-

Nov 4 (Reuters) - Arcam ARCM.ST
* Canada-based subsidiary AP&C files strategic patent
application
* Patent application covers high-yield production of fine
powder from reactive metals with a low gas to metal ratio and
low gas pressure
* Application covers the use of Plasma Atomization on
different heated metal sources such as wire, rod and melt
* AP&C's technology allows high yield production of fine
powder for all Additive Manufacturing distributions and without
ceramic contamination risk
* "The production yield is one of the key drivers to produce
powder at low cost. The combination of high-yield of fine powder
with a low gas to metal ratio of about 10 is unique to AP&C's
proprietary Plasma Atomization process", says
Jacques Mallette, President of AP&C, in statement.

Source text for Eikon: ID:nWkrkd0643
Further company coverage: ARCM.ST

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