Xintec Inc. operates as a wafer level chip scale packaging company in Asia, the United States, and Europe. It provides wafer level chip scale packaging for image and environmental sensors; wafer level post passivation interconnection for fingerprint and actuator sensors, micro-electromechanical components, power, analog, and RF components; and wafer testing services. The company also offers optical sensor chip scale packaging services comprising side-wall interconnect and through silicon via RDL interconnect products, various glass thickness and filters, and glass bonding to wafer with or without cavity; FSI/BSI/stack wafer reconstruction for mobile, automotive, and consumer applications; and specialty RW service with a glass lid for automotive applications. In addition, it provides micro-electromechanical systems sensor packaging services, such as wafer thinning and bonded wafer partial dicing to reveal bonding pad; CSP, using via last TSV to connect pad on wafer surface toward backside; and dry etching silicon to form large cavities to derive product performance needs; as well as 3D I/O redistribution, power ground enhancement, and dual side connection services. Xintec Inc. was incorporated in 1998 and is headquartered in Taoyuan City, Taiwan.
Metrics to compare | 3374 | Sector Sector - Average of metrics from a broad group of related Technology sector companies | Relationship Relationship3374PeersSector | |
|---|---|---|---|---|
P/E Ratio | 28.4x | 49.1x | 11.9x | |
PEG Ratio | −1.33 | 0.85 | 0.01 | |
Price/Book | 4.0x | 3.0x | 2.4x | |
Price / LTM Sales | 5.3x | 3.7x | 2.3x | |
Upside (Analyst Target) | 11.3% | 5.1% | 24.2% | |
Fair Value Upside | Unlock | −1.9% | 5.1% | Unlock |