Metrics to compare | 3374 | Sector Sector - Average of metrics from a broad group of related Technology sector companies | Relationship Relationship3374PeersSector | |
|---|---|---|---|---|
P/E Ratio | 71.0x | 58.5x | 12.3x | |
PEG Ratio | −4.10 | 1.38 | 0.01 | |
Price/Book | 9.8x | 4.3x | 2.4x | |
Price / LTM Sales | 13.0x | 3.8x | 2.2x | |
Upside (Analyst Target) | −44.1% | −3.5% | 38.5% | |
Fair Value Upside | Unlock | 0.1% | 7.7% | Unlock |
Xintec Inc. operates as a wafer level chip scale packaging company in Asia, the United States, and Europe. The company provides wafer level chip scale packaging, wafer-level back cover packaging, and testing services for semiconductors. It also offers optical sensor chip scale packaging services comprising side-wall interconnect and through silicon via XinTSV, various glass thickness and filters, and glass bonding to wafer with or without cavity; FSI/BSI/stack wafer reconstruction for mobile, automotive, and consumer applications; and specialty RW service with a glass lid for automotive applications. In addition, the company provides micro-electromechanical systems sensor packaging services, such as wafer thinning and bonded wafer partial dicing to reveal bonding pad; CSP, using via last TSV to connect pad on wafer surface toward backside; and dry etching silicon to form large cavities to derive product performance needs; as well as 3D I/O redistribution, power ground enhancement, and dual side connection services. Xintec Inc. was founded in 1987 and is headquartered in Taoyuan City, Taiwan.